Epoxy adhesives are endless

Epoxy adhesives have been highly sought after as environmentally friendly high-performance products in the international market. Recently, new products have emerged in an endless stream. According to reports, there are mainly three trends:

First, the viscosity properties are polarized. First, the emergence of non-flowing epoxy resin adhesive polymer adhesive EP21N, is a two-component epoxy resin adhesive for general bonding, room temperature curing or rapid temperature curing, in 1:1 weight or Volume ratio use. The second is a low-viscosity epoxy resin, such as industrial low-viscosity epoxy resin with excellent mechanical properties and electrical insulation properties at high and low temperatures. The Tr-Boud 2211 can be used continuously at 190°C. It is solvent-free and easy to mix. It can be used at room temperature.

New pressure-sensitive adhesives enable new features in transfer printing to meet the needs of labeling and printing applications. Among them Nacro 8684 has high shear, good peelability, excellent moisture resistance and clean decontamination properties. Structural adhesives for aluminum alloys also have new varieties. One-component heat-curing epoxy resin structural adhesives are used for aluminum alloy bonding. The relationship between bonding durability and the addition of hydroxyapatite (HAP) has been studied. The HAP system does indeed improve the bond durability and has nothing to do with the surface treatment of the aluminum alloy. Without HAP's structural adhesive, its durability deteriorates significantly.

New advances in polyacrylic acid microparticle-modified epoxy resin adhesives, epoxy resin adhesives containing polyacrylic acid microparticles (methyl methacrylate MMA-glycidyl methacrylate GMA copolymers) and NBP, CTBN The structural differences of the modified epoxy resin adhesives were compared and analyzed, and their adhesive properties to aluminum alloys were studied. The results show that the internal stress of the NBR modified epoxy resin is significantly reduced and the adhesive strength is significantly improved, and the acid treatment ratio is not higher, using the core-shell structure polyacrylic acid modified epoxy resin adhesive and the acrylic rubber modified epoxy resin adhesive. The treatment has a higher chemical resistance.

Loctitc and Durabond l00NS are fast-fixing, rhodium, thixotropic, two-component, industrial-grade adhesives used in the fields of parts assembly, equipment, electronics and chemical fibers. This product is cured at room temperature to form a translucent, rigid, processable adhesive layer. After it is completely cured, it can be widely used as an electronic insulation product due to its wide resistance to chemicals and solvents. The United States has also developed a 10min fast-fixing epoxy resin adhesive, which is a two-component elastic epoxy resin and suitable for various bonding applications. It has high shear strength, peel strength, impact strength, and high chemical resistance. Oil resistance.

Improved toughening adhesive performance, developed low-taste, 5min, two-component toughening adhesive for high vibration environments, trade name FCO 9508A and hardener FCO 9508B with high bond strength, shear strength and Wet strength. With high-strength adhesives coming out of the way, Tra-Bond F202 is a low-viscosity, transparent and clean material. Specially developed for high temperature, chemical resistance applications, this two component epoxy adhesive with high bond strength at 265°C can bond optical fibers and optical materials, including most Metals, ceramics, glass, and many plastics.

The development of special adhesives has received further attention. Among them, Pemabond AE98, a newly developed epoxy adhesive for medical devices, is a one-component fast low-temperature cure, suitable for heat-sensitive adhesives, and has a new adhesive between 90-120°C and a curing time of 5-60 minutes. Liu can be used for the bonding of radioactive containers, viewers and other metal surgical instruments, as well as the casting seal of filter structures.